Semiconductor light emitting apparatus including bulb and screw-type base

ABSTRACT

A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that includes an elongated wavelength conversion tube wall having wavelength conversion material, such as phosphor, dispersed therein. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein. The elongated hollow wavelength conversion tube may have an open end, a crimped end, a reflective end, and/or other configurations. Multiples tubes and/or multiple semiconductor light emitting devices may also be used in various configurations. Related assembling methods are also described.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/180,759, filed Jul. 12, 2011, entitled Semiconductor Light EmittingApparatus Including Elongated Hollow Wavelength, which itself is acontinuation of U.S. patent application Ser. No. 12/273,216, filed Nov.18, 2008, entitled Semiconductor Light Emitting Apparatus IncludingElongated Hollow Wavelength Conversion Tubes and Methods of AssemblingSame, assigned to the assignee of the present application, thedisclosures of which are hereby incorporated herein by reference as ifset forth in their entirety herein.

BACKGROUND OF THE INVENTION

This invention relates to light emitting apparatus and methods ofassembling and operating same, and more particularly to semiconductorlight emitting apparatus and methods of assembling and operating same.

Semiconductor light emitting devices (“LEDs”), such as light emittingdiodes and laser diodes, are widely known solid-state lighting elementsthat are capable of generating light upon application of voltagethereto. Light emitting devices generally include a p-n junction, ananode ohmic contact for the p-type region of the device, and a cathodeohmic contact for the n-type region of the device. The device may beformed on a substrate, such as a sapphire, silicon, silicon carbide,gallium arsenide, gallium nitride, etc., substrate, or the device maynot include a substrate. The semiconductor p-n junction may befabricated, for example, from silicon carbide, gallium nitride, galliumphosphide, aluminum nitride and/or gallium arsenide-based materialsand/or from organic semiconductor-based materials.

Semiconductor LEDs may be used in lighting/illumination applications,for example, as a replacement for conventional incandescent and/orfluorescent lighting. As such, it is often desirable to provide alighting source that generates white light having a relatively highcolor rendering index (CRI), so that objects illuminated by the lightingmay appear more natural. The color rendering index of a light source isan objective measure of the ability of the light generated by the sourceto accurately illuminate a broad range of colors. The color renderingindex ranges from essentially zero for monochromatic sources to nearly100 for incandescent sources.

In addition, the chromaticity of a particular light source may bereferred to as the “color point” of the source. For a white lightsource, the chromaticity may be referred to as the “white point” of thesource. The white point of a white light source may fall along a locusof chromaticity points corresponding to the color of light emitted by ablack-body radiator heated to a given temperature. Accordingly, a whitepoint may be identified by a correlated color temperature (CCT) of thelight source, which is the temperature at which the heated black-bodyradiator matches the color or hue of the white light source. White lighttypically has a CCT of between about 4000 and 8000K. White light with aCCT of 4000 has a yellowish color. White light with a CCT of 8000K ismore bluish in color, and may be referred to as “cool white”. “Warmwhite” may be used to describe white light with a CCT of between about2600K and 3500K, which is more reddish in color.

In order to produce white light, multiple LEDs emitting light ofdifferent colors of light may be used. The light emitted by the LEDs maybe combined to produce a desired intensity and/or color of white light.For example, when red-, green- and blue-emitting LEDs are energizedsimultaneously, the resulting combined light may appear white, or nearlywhite, depending on the relative intensities of the component red, greenand blue sources. However, in LED lamps including red, green, and blueLEDs, the spectral power distributions of the component LEDs may berelatively narrow (e.g., about 10-30 nm full width at half maximum(FWHM)). While it may be possible to achieve fairly high luminousefficacy and/or color rendering with such lamps, wavelength ranges mayexist in which it may be difficult to obtain high efficiency (e.g.,approximately 550 nm).

Alternatively, the light from a single-color LED may be converted towhite light by surrounding the LED with a wavelength conversionmaterial, such as phosphor particles. The term “wavelength conversionmaterial” is used herein to refer to any material that absorbs light atone wavelength and re-emits light at a different wavelength, regardlessof the delay between absorption and re-emission and regardless of thewavelengths involved. Accordingly, the term “wavelength conversionmaterial” may be used herein to refer to materials that are sometimescalled fluorescent and/or phosphorescent and often referred to as“phosphors”. In general, phosphors absorb light having shorterwavelengths and re-emit light having longer wavelengths. As such, someor all of the light emitted by the LED at a first wavelength may beabsorbed by the phosphor particles, which may responsively emit light ata second wavelength. For example, a blue emitting LED may be surroundedby a yellow phosphor, such as cerium-doped yttrium aluminum garnet(YAG). The resulting light, which is a combination of blue light andyellow light, may appear white to an observer.

Accordingly, efforts have been made to integrate a semiconductor lightemitting device with wavelength conversion material to provide asemiconductor light emitting apparatus. The wavelength conversionmaterial may be coated on the LED itself, may be provided in a drop ofmaterial between the semiconductor LED and the dome of an LED (alsoreferred to as a shell or lens) and/or may be provided remote from thesemiconductor LED by providing wavelength conversion material inside,outside and/or within the dome of an LED and/or on/within anothersurface remote from the LED.

SUMMARY OF THE INVENTION

Semiconductor light emitting apparatus according to various embodimentsof the present invention include an elongated hollow wavelengthconversion tube that comprises an elongated wavelength conversion tubewall having wavelength conversion material such as phosphor dispersedtherein uniformly or non-uniformly. The tube need not be cylindrical. Asemiconductor light emitting device is oriented to emit light inside theelongated hollow wavelength conversion tube to impinge upon theelongated wavelength conversion tube wall and the wavelength conversionmaterial dispersed therein.

In some embodiments, the semiconductor light emitting device is orientedsuch that at least 20% of the emitted light strikes the elongated hollowwavelength conversion tube wall at an oblique angle. In otherembodiments, the semiconductor light emitting device is oriented suchthat at least about 90% of the emitted light strikes the elongatedhollow wavelength conversion tube at an oblique angle. In someembodiments, the semiconductor light emitting device is confined to emitlight in a Lambertian pattern about an emission axis. In otherembodiments, the semiconductor light emitting device is configured toemit light in a non-Lambertian pattern, such as a focused pattern.

Various other embodiments of the invention can provide an elongatedhollow wavelength conversion tube that is oriented relative to thesemiconductor light emitting device, so as to provide a longer pathlength through the elongated wavelength conversion tube wall for lightthat is emitted by the semiconductor light emitting device that does notstrike the wavelength conversion material embedded therein withoutincreasing the path length of light that is converted by striking thewavelength conversion material embedded therein. In some embodiments,the semiconductor light emitting device is a blue light emitting diodehaving an area of about 1 mm², and the apparatus produces about 160lumens per watt at a color temperature of about 4700K. In otherembodiments, the apparatus produces about 150 lumens per watt at a colortemperature of about 5500K.

The elongated hollow wavelength conversion tube may itself have variousconfigurations according to various embodiments. In some embodiments,the elongated hollow wavelength conversion tube includes inner and outersurfaces, and a supporting layer is provided on the inner surface and/oron the outer surface. In other embodiments, the inner and/or outersurfaces are textured uniformly or non-uniformly. In some embodiments,the tube wall defines a tube axis, and the semiconductor light emittingdevice is configured to emit light symmetrically about an emission axis.The semiconductor light emitting device is oriented such that theemission axis is coincident with the tube axis.

Various other configurations of elongated hollow wavelength conversiontubes may be provided. For example, in some embodiments, the elongatedhollow wavelength conversion tube includes first and second opposingends, and the semiconductor light emitting device is adjacent the firstend. In some embodiments, the second end is a closed end, whereas inother embodiments the second end is a crimped second end. In still otherembodiments, a cap is provided at the second end, and in yet otherembodiments, the cap may comprise a wavelength conversion materialand/or a reflective material.

In still other embodiments, multiple semiconductor light emittingdevices may be provided. For example, in some embodiments, a secondsemiconductor light emitting device is provided adjacent the second endthat is oriented to emit light inside the elongated hollow wavelengthconversion tube. In some of these embodiments, a double-sided reflectormay be provided in the elongated hollow wavelength conversion tubebetween the first and second semiconductor light emitting devices. Inother embodiments, the elongated hollow wavelength conversion tube maybe crimped between the first and second semiconductor light emittingdevices.

In still other embodiments, the semiconductor light emitting deviceextends at least partially into the elongated hollow wavelengthconversion tube. In some of these embodiments, the semiconductor lightemitting device extends partially into the wavelength conversion tube toemit light towards a first end thereof. In still other embodiments, asecond semiconductor light emitting device may extend at least partiallyinto the elongated hollow wavelength conversion tube to emit lighttowards a second end thereof. In yet other embodiments, the first andsecond semiconductor light emitting devices may be oriented inback-to-back relation within the elongated hollow wavelength conversiontube. In still other embodiments, a screw-type base may be provided aswell as a pair of standoffs that maintain the elongated hollowwavelength conversion tube and the first and second semiconductor lightemitting devices spaced apart from the screw-type base. A bulb may alsobe provided that is connected to the screw-type base and surrounds thehollow wavelength conversion tube and the first and second semiconductorlight emitting devices.

Apparatus according to various embodiments of the present invention mayalso include a mounting substrate and a dome on the mounting substrate,with the semiconductor light emitting device being located between themounting substrate and the dome. The dome may extend at least partiallyinto an end of the elongated hollow wavelength conversion tube, and themounting substrate may extend at least partially outside the elongatedhollow wavelength conversion tube.

Multi-tube embodiments also may be provided. For example, in someembodiments, the apparatus further comprises a second elongated hollowwavelength conversion tube, and the first and second elongated hollowwavelength conversion tube share a common end. The semiconductor lightemitting device is adjacent the common end. In other embodiments, aplurality of elongated hollow wavelength conversion tubes may share thecommon end and extend around a central axis. In yet other embodiments, asecond elongated hollow wavelength conversion tube is provided that iscoaxial to a first elongated hollow wavelength conversion tube.

Semiconductor light emitting apparatus according to still otherembodiments of the present invention may comprise a plurality of lightemitting filaments. A respective light emitting filament comprises anelongated hollow wavelength conversion tube that includes an elongatedwavelength conversion tube wall having wavelength conversion materialdispersed therein, and a semiconductor light emitting device that isoriented to emit light inside the elongated hollow wavelength conversiontube. The plurality of light emitting filaments may be orientedend-to-end in a linear array, in some embodiments. In other embodiments,the plurality of light emitting filaments may extend about a commonorigin in a three-dimensional array. The elongated hollow wavelengthconversion tube(s) and the semiconductor light emitting device(s) may beprovided according to any of the embodiments described herein.

Methods of assembling semiconductor light emitting apparatus may also beprovided. In these methods, a dome that surrounds a semiconductor lightemitting device that is on a substrate is inserted at least partiallyinto an end of an elongated hollow wavelength conversion tube havingwavelength conversion material dispersed therein. The elongated hollowwavelength conversion tube may be crimped remote from the end. Thesemiconductor light emitting device and the elongated hollow wavelengthconversion tube may be configured according to any of the embodimentsdescribed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A a perspective view of a semiconductor light emitting apparatusaccording to various embodiments.

FIG. 1B is a cross-sectional view of a semiconductor light emittingapparatus according to other embodiments.

FIGS. 2A and 2B are cross-sectional views of packaged semiconductorlight emitting devices.

FIGS. 3-10 are cross-sectional views of semiconductor light emittingapparatus according to various other embodiments.

FIGS. 11A-14 are cross-sectional views of elongated hollow wavelengthconversion tubes according to various embodiments.

FIGS. 15-18 are cross-sectional views of semiconductor light emittingapparatus according to still other embodiments.

FIG. 19 graphically illustrates efficiency in lumens per watt as afunction of CCT for semiconductor light emitting apparatus according tovarious embodiments.

DETAILED DESCRIPTION

The present invention now will be described more fully with reference tothe accompanying drawings, in which various embodiments are shown. Thisinvention may, however, be embodied in many different forms and shouldnot be construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the invention to thoseskilled in the art. In the drawings, the size and relative sizes oflayers and regions may be exaggerated for clarity. Like numbers refer tolike elements throughout.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprising”, “including”, “having” and variants thereof, when used inthis specification, specify the presence of stated features, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, steps, operations,elements, components, and/or groups thereof. In contrast, the term“consisting of” when used in this specification, specifies the statedfeatures, steps, operations, elements, and/or components, and precludesadditional features, steps, operations, elements and/or components.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may also bepresent. Furthermore, relative terms such as “beneath” or “overlies” maybe used herein to describe a relationship of one layer or region toanother layer or region relative to a substrate or base layer asillustrated in the figures. It will be understood that these terms areintended to encompass different orientations of the device in additionto the orientation depicted in the figures. Finally, the term “directly”means that there are no intervening elements. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items and may be abbreviated as “/”.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings of the present invention.

Embodiments of the invention are described herein with reference tocross-sectional and/or other illustrations that are schematicillustrations of idealized embodiments of the invention. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments of the invention should not be construed aslimited to the particular shapes of regions illustrated herein but areto include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as arectangle will, typically, have rounded or curved features due to normalmanufacturing tolerances. Thus, the regions illustrated in the figuresare schematic in nature and their shapes are not intended to illustratethe precise shape of a region of a device and are not intended to limitthe scope of the invention, unless otherwise defined herein.

Unless otherwise defined herein, all terms (including technical andscientific terms) used herein have the same meaning as commonlyunderstood by one of ordinary skill in the art to which this inventionbelongs. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand this specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

FIGS. 1A and 1B are a perspective view and a cross-sectional view ofsemiconductor light emitting apparatus according to various embodimentsof the present invention. As shown in FIGS. 1A and 1B, thesesemiconductor light emitting apparatus include an elongated hollowwavelength conversion tube 110 that comprises an elongated wavelengthconversion tube wall 112 having wavelength conversion material 114uniformly or non-uniformly dispersed therein. As used herein, a tubedenotes a long hollow object that may be, but need not be, cylindrical.Accordingly, the tube may be circular, elliptical, ellipsoidal and/orpolygonal. A semiconductor light emitting device 120 is oriented to emitlight 122 inside the elongated hollow wavelength conversion tube 110 toimpinge upon the elongated wavelength conversion tube wall 112 and thewavelength conversion material 114 dispersed therein. In someembodiments, the semiconductor light emitting device 120 may be apackaged light emitting diode 130 that includes a mounting substrate 124and a dome 126 on the mounting substrate 124, wherein the semiconductorlight emitting device 120 is located between the mounting substrate 124and the dome 126. One or more electrical leads 128 may extend from themounting substrate 124. As also shown in FIGS. 1A and 1B, the tube wall112 defines a tube axis 132, and the semiconductor light emitting device120 is configured to emit light 122 generally symmetrically about anemission axis and is oriented such that the emission axis is generallycoincident with the tube axis 132.

Various configurations of the semiconductor light emitting device 120,the mounting substrate 124 and the dome 126 may be provided according tovarious embodiments of the present invention. In some embodiments, thepackaged semiconductor light emitting device 130 may be represented by acommercially available LED, such as a Cree® EZ1000™ LED, manufactured bythe assignee of the present invention, and described in the Data SheetCPR3CR, Rev. A, entitled Cree® EZ1000™ LEDs Data SheetCxxxEZ1000-Sxx000, copyright 2006, Cree, Inc., available on the Web atcree.com. As indicated in this data sheet, these LEDs may use a singlesemiconductor die of size 980/980 μm² or about 1 mm². These LEDs mayoperate at a voltage of about 3 V (more typically about 3.3 V), and acurrent of about 350 mA (current density of about 35 A/cm²) for an inputpower of about 1 watt. The Cree EZ1000 LED may be manufactured under oneor more of the following U.S. patents/applications, the disclosures ofwhich are hereby incorporated herein in their entirety as if set forthfully herein: U.S. Pat. No. D566,057, issued Apr. 8, 2008, entitled LEDChip; U.S. Application Publication No. 2008/0173884, published Jul. 24,2008, entitled Wafer Level Phosphor Coating Method and DevicesFabricated Utilizing Same; U.S. Application Publication No.2008/0179611, published Jul. 31, 2008, entitled Wafer Level PhosphorCoating Method and Devices Fabricated Utilizing Same; and U.S.application Ser. No. 29/284,431, filed Sep. 7, 2007, entitled LED Chip.However, other commercially available packaged LEDs or bare LED dice maybe used.

The EZ1000 LED may be provided on a silver (Ag) header and encapsulatedwith a dome comprising, for example, Hysol® OS4000 fast curingwater-white epoxy casting compound, marketed by Loctite. However, inother embodiments, other materials, such as epoxy, silicone and/or othertransparent encapsulants may also be used. Moreover, the LED need nothave a dome, so that a bare die or a domeless LED also may be used. Insome embodiments, as shown in FIG. 1A, the semiconductor light emittingdevice 120 may be adjacent but not within the elongated hollowwavelength conversion tube 110. In other embodiments, as shown in FIG.1B, the semiconductor light emitting device 120 may be at leastpartially within the elongated hollow wavelength conversion tube 110. Instill other embodiments, the transparent dome 126 may be entirely withinthe elongated hollow wavelength conversion tube 110, whereas themounting substrate 124 may be entirely outside and up against an end ofthe elongated hollow wavelength conversion tube.

In fact, FIGS. 1A and 1B also illustrate methods of assembling asemiconductor light emitting apparatus according to some embodiments,wherein a dome 126 that surrounds a semiconductor light emitting device120 that is on a substrate 124 is inserted at least partially into anend of an elongated hollow wavelength conversion tube 110 havingwavelength conversion material 114 dispersed therein. The dome may bepress-fit inside the tube or an adhesive or other attaching element maybe used.

The elongated hollow wavelength conversion tube 110 may be constructedfrom a sheet of plastic, epoxy, silicone and/or other transparent ortranslucent material, such as the aforementioned OS4000 material, thatcontains phosphor dispersed therein. The material may be mixed withphosphor at a desired concentration and then formed into a sheet, whichis allowed to cure. The sheet may be rolled and glued into a tube andcut to a desired length. Alternatively, straws of plastic materialincluding phosphor encapsulated therein may be provided and cut to size.Moreover, the hollow wavelength conversion tube 110 may be molded,extruded and/or formed by other conventional processes. The phosphor maybe conventional YAG phosphor, conventional (Ca, Si, Ba) SiO₄:Eu²⁺ (BOSE)phosphor and/or other conventional phosphors that may vary incomposition and/or concentration depending upon the characteristics ofthe semiconductor light emitting device 120 and/or other parameters. Theelongated hollow wavelength conversion tube 110 may be evacuated,air-filled or filled with an inert and/or reactive gas. The tube mayalso include a solid and/or gel therein to provide, for example,encapsulant, index matching, etc. The wavelength conversion material 114may be uniformly or non-uniformly dispersed in the elongated wavelengthconversion tube wall 112. Uniform or non-uniform composition and/orconcentration may be employed.

Dimensionally, the elongated hollow wavelength conversion tube 110 mayhave a length of between about 1 mm and about 100 mm, and an innerdiameter of between about 0.5 mm and about 10 mm. The tube wall 112 mayhave a thickness of between about 0.05 mm and about 2 mm. Wavelengthconversion particles may be dispersed therein at concentrations betweenabout 1% and about 70% by weight. The use of an elongated hollowwavelength conversion tube according to various embodiments of theinvention may provide efficient white light. For example, a Cree EZ1000LED having about a 1 mm² size and a drive current of about 350 mA atroom temperature in combination with an elongated hollow wavelengthconversion tube that is about 45 mm long, having an inside diameter ofabout 9 mm and a wall thickness of about 2 mm, and being fabricated froma sheet of flexible transparent silicone having Intematix BOSE phosphordispersed therein at a concentration of about 30% by weight, can produceabout 170 lumens of light output, about 160 lumens/watt efficiency atcolor temperature of about 4700K, and about 150 lumens/watt efficiencyat color temperature of about 5500K. FIG. 19 graphically illustratesefficiency in lumens/watt (1 m/w) vs. CCT, for these exampleembodiments. It will be understood that, in FIG. 19, variousconcentrations of phosphors may be used to obtain the desired colortemperature.

Without wishing to be bound by any theory of operation, high efficiencywhite light production may be obtained according to various embodimentsof the present invention by causing almost all of the light that isemitted by the semiconductor light emitting device 120 to strike theelongated wavelength conversion tube wall 112 at an oblique angle. Morespecifically, referring to FIG. 2A, a packaged light emitting diode mayemit light in a Lambertian pattern 220, wherein the radiant intensity isdirectly proportional to the cosine of the angle between the observer'sline of sight and an axis 210 that is normal to the surface of thesemiconductor light emitting device 130. The Lambertian pattern 220 maybe obtained by designing the light emitting device 120 to emit light ina Lambertian pattern, and designing the dome 126 so as not to changethis emission pattern, or by designing the light emitting device 120 toemit light in a non-Lambertian pattern and by designing one or moreoptical elements in the dome 126, so that the light that emerges fromthe dome 126 is Lambertian. In other embodiments, as shown in FIG. 2B, apackaged or unpackaged light emitting diode may emit light in a focused(i.e., narrow far-field emission) pattern 230, wherein more radiantenergy is emitted closer to the axis 210 of emission than to the sides.Again, this focused pattern may be obtained by designing the lightemitting device 120 to emit light in a focused pattern and designing thedome 126 so as to not change this emission pattern or by designing thelight emitting device 120 to emit light in a non-focused pattern and bydesigning one or more optical elements in the dome 126 so that the lightemerges from the dome 126 in a focused pattern. Other conventionalemission patterns may be used.

Conventionally, the dome 126 may be designed to be hemispherical so thatthe emitted light 122 crosses the dome perpendicular to the domesurface. Thus, if phosphor is coated on the inner and/or outer surfacesof the dome 126, much of the emitted light will be backscattered intothe device 120. In sharp contrast, when the packaged LED 130 is mountedrelative to an elongated hollow wavelength conversion tube as shown inFIG. 1B, at least 20% of the emitted light 122 can strike the elongatedhollow wavelength conversion tube wall 112 at an oblique angle, as shownin FIG. 1B. The backscattering of light back into the semiconductorlight emitting device 120 may be substantially reduced. Moreover, insome embodiments, at least about 90% of the emitted light 122 can strikethe elongated hollow wavelength conversion tube wall 112 at an obliqueangle, as shown in FIG. 1B. The backscattering of light back into thesemiconductor light emitting device may be substantially reduced.

Accordingly, some embodiments of the present invention may allow lightthat is emitted from the semiconductor light emitting device 120 to passthrough the dome 126 generally orthogonal thereto, but to strike theelongated hollow wavelength conversion tube wall 112 substantiallyoblique thereto. Thus, some embodiments of the invention may be regardedas providing a primary optical surface, such as the dome 126 of thepackaged light emitting diode 130, wherein Lambertian radiation causesalmost all of the emitted light to cross the surface orthogonal thereto,and the elongated wavelength conversion tube wall 112 provides asecondary optical surface including wavelength conversion material 114dispersed therein, wherein almost all of the light impinges on thesecondary optical surface 112 at an oblique angle thereto.

Without wishing to be bound by any theory of operation, high efficiencyof embodiments of the present invention may also be explained due todifferent path lengths that may be established within the elongatedhollow wavelength conversion tube 110. In particular, referring to FIGS.3 and 3A, the emitted light 122 from the semiconductor light emittingdevice 120 reflects off the inner surface of the tube wall 110, as shownby ray 310, and also refracts within the tube wall, as shown by ray 312.Additional internal reflection takes place from the outer wall, as shownas by ray 314, and some of the original light 316 emerges from the tube.The path through the wall 112 is indicated by ray 312. In contrast, whenlight strikes a phosphor particle 114 that is embedded within the tubewall 112, it is converted and scattered in all directions, as shown bythe rays 322.

Accordingly, as shown in FIGS. 3 and 3A, except for near thesemiconductor light emitting device 120, very little light is reflectedback at the semiconductor light emitting device 120. In order for thelight 122, such as blue light, that emerges from the semiconductor lightemitting device 120 to convert, for example to yellow light, it mustimpinge on a wavelength conversion material (e.g., phosphor) particle114. Once it does convert, it is desirable for the converted emission322 to escape with minimal obstruction, not only from the LED 130 butalso from other wavelength conversion material particles 114. Thus, itis desirable for the wavelength conversion material layer to appearthick for the blue light, but thin for the yellow emission 322. The tube110 helps to achieve this, because the blue light has a longer path 312through the tube wall 112 at grazing incidence and the same amount ofconversion can be achieved with less wavelength conversion material 114.Thus, since the blue light has a longer path length 312 through the tubewall 112 at grazing incidence, the tube appears thicker for the incomingblue light. Since the tube appears thicker, a lower concentration ofphosphor may be used. By using a lower concentration of phosphor, lessphosphor obstruction may be provided. Accordingly, in some embodiments,the elongated hollow wavelength conversion tube 110 is oriented relativeto the semiconductor light emitting device 120, so as to provide alonger path length 312 through the elongated wavelength conversion tubewall 112 for light 122 that is emitted by the semiconductor lightemitting device 120 that does not strike the wavelength conversionmaterial 114 embedded therein, without increasing the path length oflight 322 that is converted by the wavelength conversion material 114embedded therein.

Various configurations of elongated hollow wavelength conversion tubesmay be provided according to various embodiments of the presentinvention. For example, as shown in FIG. 4, the elongated hollowwavelength conversion tube 110 includes first and second opposing ends110 a, 110 b, and the semiconductor light emitting device 120 isadjacent the first end 110 a. It will also be understood that in FIG. 4and other figures to follow, the semiconductor light emitting device 120is shown outside the elongated hollow wavelength conversion tube 110. Inthese embodiments, a reflector, lens and/or other optical element may beprovided to direct the light 122 inside the tube 110. However, in otherembodiments, the semiconductor light emitting device 120 may extend atleast partially into the elongated hollow wavelength conversion tube110. In yet other embodiments, the semiconductor light emitting device120 extends fully into the elongated hollow wavelength conversion tube110.

In FIG. 4, the second end 110 b is an open end. In contrast, in FIG. 5,the second end 110 b is a closed second end, which may be provided by acap 510. The cap 510 may be reflective and/or may contain wavelengthconversion material therein. The cap 510 may be planar or non-planar asillustrated. For example, a hemispherical, prismatic, textured and/ormicrolens-covered cap may be provided. The wavelength conversionmaterial in the cap 510 may be same as, or different from the wavelengthconversion material 114 in the elongated wavelength conversion tube wall112 in terms of composition and/or concentration. In other embodiments,as shown in FIG. 6, the second end 110 b is a crimped second end 610. Itwill be understood that the word “crimped” is used herein to denote atapered end, and not to denote any particular manufacturing method.Thus, FIG. 6 illustrates embodiments of bullet-shaped elongated hollowwavelength tubes 110.

Embodiments of the invention that have been described above employ oneor more semiconductor light emitting devices 120 at a first end 110 a ofthe elongated hollow wavelength conversion tube 110. However, in otherembodiments, at least one semiconductor light emitting device may beprovided at both ends of the tube 110. For example, as shown in FIG. 7,a first semiconductor light emitting device 120 a is included adjacentthe first end 110 a of the elongated hollow wavelength conversion tube110, and oriented to emit light inside the elongated hollow wavelengthconversion tube 110. A second semiconductor light emitting device 120 bis located adjacent the second end 110 b and is oriented to emit light122 b inside the elongated hollow wavelength conversion tube.

FIG. 8 illustrates other embodiments wherein a double-sided reflector810 is included in the elongated hollow wavelength conversion tube 110between the first and second semiconductor light emitting devices 120 a,120 b. The double-sided reflector 810 may be embodied as a mirror, aball bearing and/or other device that reflects at least some lightimpinging thereon. For example, a spherical, prismatic, textured and/ormicrolens-covered double-sided reflector may be provided. Thedouble-sided reflector 810 may be flat or non-planar as shown. Thedouble-sided reflector also may include wavelength conversion material.FIG. 9A illustrates other embodiments wherein the elongated hollowwavelength conversion tube 110 is crimped as shown at 910, between thefirst and second semiconductor light emitting devices 120 a, 120 b. FIG.9A shows a gradual crimp that is fully closed, whereas FIG. 9Billustrates an abrupt crimp 920 that is not fully closed.

FIG. 10 illustrates other embodiments wherein the first and secondsemiconductor light emitting devices 120 a, 120 b are oriented inback-to-back relation within the elongated hollow wavelength conversiontube 110, such that the first semiconductor device 120 a emits light 122a towards the first end 110 a and the second semiconductor lightemitting device 120 b emits light 122 b towards the second end 110 b. Inother embodiments, the first and/or second ends 110 a, 110 b may includea cap, such as a cap 510 of FIG. 5, may be crimped or tapered, such asby including crimp 610 of FIG. 6, or may be open as shown. Also, the twoends need not have the same type of termination.

The elongated hollow wavelength conversion tube 110 itself may also havemany different configurations. For example, in FIG. 11A, the elongatedtube wall 112 includes inner and outer surfaces wherein the inner and/orouter surfaces are textured as shown. The texturing may be uniformand/or non-uniform. Texturing may enhance scattering of light. Moreover,FIG. 11B illustrates other embodiments wherein a sawtooth pattern orother pattern may be used to guide the unconverted light, so as tofurther increase its path length in the wavelength conversion tube.Other light guiding patterns may also be used.

In other embodiments, as shown in FIGS. 12 and 13, a supporting layermay be provided to support the elongated wavelength conversion tube wall112. In FIG. 12, the supporting layer 1210 is on the outer surface ofthe elongated hollow wavelength conversion tube wall 112, whereas inFIG. 13, the supporting layer is on the inner surface of the elongatedhollow wavelength conversion tube wall 112. In fact, embodiments ofFIGS. 12 and 13 may be fabricated by coating a wavelength conversionmaterial 114 inside or outside a supporting tube 1210, 1310,respectively, so that the elongated hollow wavelength conversion tube110 may actually be embodied as a coating on a supporting material. Instill other embodiments, a supporting layer may be provided on both theinside and outside surfaces of the elongated wavelength conversion tubewall 112.

Multiple concentric elongated hollow conversion tubes 112 also may beprovided according to other embodiments. In particular, as shown in FIG.14, a first elongated hollow wavelength conversion tube 112 a and asecond elongated hollow wavelength conversion tube 112 b are providedcoaxial to one another. The tubes may be spaced apart and may besupported by a common supporting layer 1410. In fact, embodiments ofFIG. 14 may be fabricated by coating inner and outer surfaces of asupporting layer 1410 with wavelength conversion material 114. Inembodiments of FIG. 14, the wavelength conversion material 114 dispersedin the first and second elongated wavelength conversion tube walls 112a, 112 b may be the same or may be different in composition and/orconcentration.

FIG. 15 illustrates other embodiments wherein a plurality of elongatedhollow wavelength conversion tubes 110 are provided for a semiconductorlight emitting device 120 or a cluster of semiconductor light emittingdevices 120. Thus, a semiconductor light emitting device 120, or acluster of semiconductor light emitting devices 120, is adjacent a firstend of each of the tubes. In FIG. 16, the elongated hollow wavelengthconversion tubes 110 extend about a common origin, and the semiconductorlight emitting device 120 is adjacent the common origin. In someembodiments, FIG. 16 may be regarded as a cross-sectional view showing aplurality of hollow wavelength conversion tubes 110 that surround acommon origin and extend within the plane of the figure to provide atwo-dimensional array. FIG. 16 may also be regarded as illustrating across-section of a three-dimensional array of hollow elongated tubes 110that extend around a common axis 1600, as shown by arrow 1610. Thus,flower petal-like designs may be provided for semiconductor lightemitting apparatus according to these embodiments.

Various embodiments of the invention as described above may also beregarded as providing a semiconductor light emitting filament that maybe analogized to the filament of a conventional incandescent lamp or toa miniature fluorescent bulb. Thus, as shown in FIG. 17, an elongatedhollow wavelength conversion tube 110 includes a packaged semiconductorlight emitting device 130 at either end. The packaged semiconductordevices 130 may be mounted on a base 1710 using heat conductivestandoffs 1720 and/or other conventional mounting techniques. A bulb1730 and a screw-type base 1740 may be provided, so that the combinationof the elongated hollow wavelength conversion tube 110 and the packagedsemiconductor light emitting devices 130 at opposite ends thereofprovides a filament for a drop-in replacement for an incandescent bulb.It will be understood that FIG. 17 provides a simplified representationand that a drop-in replacement for an incandescent bulb may also employvoltage conversion circuits, thermal management systems, etc.

In other embodiments, as shown in FIG. 18, the filaments are orientedend-to-end in a linear array. Heat sinks 1810 and/or a reflector 1820may also be provided.

Many different embodiments have been disclosed herein, in connectionwith the above description and the drawings. It will be understood thatit would be unduly repetitious and obfuscating to literally describe andillustrate every combination and subcombination of these embodiments.Accordingly, the present specification, including the drawings, shall beconstrued to constitute a complete written description of allcombinations and subcombinations of the embodiments described herein,and of the manner and process of making and using them, and shallsupport claims to any such combination or subcombination. For example,any of the embodiments illustrated herein may include a baresemiconductor light emitting device die or a packaged semiconductor LED;an open-ended, capped or crimped end; one or more bare or packagedsemiconductor light emitting devices that are entirely outside,partially inside or fully inside the elongated hollow wavelengthconversion tube; one or more supporting layers; one or more elongatedhollow wavelength conversion tubes arranged concentrically or in a two-or three-dimensional array and/or packaged to include heat sinks,reflectors, driving circuitry and/or other components.

In the drawings and specification, there have been disclosed embodimentsof the invention and, although specific terms are employed, they areused in a generic and descriptive sense only and not for purposes oflimitation, the scope of the invention being set forth in the followingclaims.

What is claimed is:
 1. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; a plurality of semiconductor light emitting devices in the bulb that face one another; and voltage conversion circuits for the plurality of semiconductor light emitting devices.
 2. An apparatus according to claim 1 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.
 3. An apparatus according to claim 2 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.
 4. An apparatus according to claim 2 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.
 5. An apparatus according to claim 1 wherein the base comprises a screw-type base.
 6. An apparatus according to claim 1 further comprising a thermal management system for the plurality of semiconductor light emitting devices.
 7. An apparatus according to claim 6 wherein the thermal management system comprises at least one heat sink.
 8. An apparatus according to claim 7 wherein the at least one heat sink comprises at least one thermally conductive standoff.
 9. An apparatus according to claim 1 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb.
 10. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; first and second light emitting diodes in the bulb that face one another; first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes; and a reflector between a respective light emitting diode and a respective heat sink.
 11. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; and a plurality of semiconductor light emitting devices in the bulb that face one another, wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the domes of the plurality of semiconductor light emitting devices face one another.
 12. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; and a plurality of semiconductor light emitting devices in the bulb that face inwardly into the bulb, wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the plurality of semiconductor light emitting devices emit light inwardly into the bulb through the respective dome.
 13. An apparatus according to claim 12 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.
 14. An apparatus according to claim 13 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.
 15. An apparatus according to claim 13 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.
 16. An apparatus according to claim 12 wherein the base comprises a screw-type base.
 17. An apparatus according to claim 12 further comprising a thermal management system for the plurality of semiconductor light emitting devices.
 18. An apparatus according to claim 17 wherein the thermal management system comprises at least one heat sink.
 19. An apparatus according to claim 18 wherein the at least one heat sink comprises at least one thermally conductive standoff.
 20. An apparatus according to claim 12 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb.
 21. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; a plurality of semiconductor light emitting devices in the bulb that face inwardly into the bulb; and voltage conversion circuits for the plurality of semiconductor light emitting devices.
 22. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base; first and second light emitting diodes in the bulb that face inwardly into the bulb; first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes; and a reflector between a respective light emitting diode and a respective heat sink.
 23. A semiconductor light emitting apparatus comprising: a base; a bulb that is connected to the base to define a central axis of the semiconductor light emitting apparatus; a plurality of semiconductor light emitting devices in the bulb that are offset from, and face, the central axis of the semiconductor light emitting apparatus; and voltage conversion circuits for the plurality of semiconductor light emitting devices.
 24. An apparatus according to claim 23 wherein the plurality of semiconductor light emitting devices comprise first and second light emitting diodes.
 25. An apparatus according to claim 24 wherein the first and second light emitting diodes are first and second packaged light emitting diodes.
 26. An apparatus according to claim 24 further comprising first and second heat sinks, a respective one of which is thermally coupled to a respective one of the first and second light emitting diodes.
 27. An apparatus according to claim 26 further comprising a reflector between a respective light emitting diode and a respective heat sink.
 28. An apparatus according to claim 23 wherein the base comprises a screw-type base.
 29. An apparatus according to claim 23 further comprising a thermal management system for the plurality of semiconductor light emitting devices.
 30. An apparatus according to claim 29 wherein the thermal management system comprises at least one heat sink.
 31. An apparatus according to claim 30 wherein the at least one heat sink comprises at least one thermally conductive standoff.
 32. An apparatus according to claim 29 wherein each of the plurality of semiconductor light emitting devices includes a mounting substrate and a dome on the mounting substrate, and wherein the plurality of semiconductor light emitting devices emit light through the respective dome towards the axis of the semiconductor light emitting apparatus.
 33. An apparatus according to claim 23 wherein the base, the bulb and the plurality of semiconductor light emitting devices are configured to provide a drop-in replacement for an incandescent bulb. 